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COB Type Package
May 31, 2016

COB packaging you can encapsulate many chips directly on the metal based PCB MCPCB, directly through the base plate heat sink, not only to reduce cost of manufacturing process and also reduce the thermal resistance of the heat sink advantages.

From the perspective of cost and application, COB became the mainstream of future lighting design direction. COB LED module installed on the bottom of the package has an LED chip, chip can not only improve brightness, also helps to realize the reasonable configuration of LED chips, reducing the input current of a single LED chip to ensure efficiency. And this surface light source in the cooling area in the expanded package to a large extent, making it easier for heat transfer to the shell.

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