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Led Technology Introduced
May 31, 2016

1, wafer expansion, sprinkled with wafer arranged to open a point easy to die.

2, die, in the bottom of the bracket on the conductive/non conductive glue (conducting or not depending on the chip around is a PN junction or a PN junction) and then the bracket and insert the chip inside.

3, short Grill, allow glue wire chip does not move.

4, wire, gold chips and support conducting.

5, pretest, preliminary tests can light up.

6, glue, glue chip and supports wrapped up.

7, long Grill, allow the glue to cure.

8 and after, test worked or not as well as the electrical parameters are met.

9, spectrophotometer, generally consistent product color and voltage out.

10, packaging.

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